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Cyclone Series Device Thermal Resistance
May 2008, version 3.0 Data Sheet
Revision History
Date
May 2008 July 2007 May 2007 March 2007 April 2006
The following table shows the revision history for this data sheet.
Document Version
3.0 2.2 2.1 2.0 1.0
Changes Made
Updated Tables 2, 4, and 5. Updated values for EP3C25 (E144) device in Table 2. Updated values for EP3C10 (E144) device in Table 2 and added Revision History. Added Cyclone III information. Initial release.
Tables 1 through 6 in this data sheet provide JA (junction-to-ambient thermal resistance) and JC (junction-to-case thermal resistance) values for Altera(R) Cyclone(R) series devices available in Ball-Grid Array (BGA), FineLine(R) BGA (FBGA), Micro FineLine BGA(R) (MBGA), Ultra FineLine BGA (UBGA), Pin-Grid Array (PGA), Plastic J-Lead Chip Carrier (PLCC), Plastic Enhanced Quad Flat Pack (EQFP), Thin Quad Flat Pack (TQFP), Plastic Quad Flat Pack (PQFP), and Power Quad Flat Pack (RQFP).
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For additional packaging information, refer to the Altera Device Packaging Data Sheet.
Altera Corporation
DS-CYTHRML-3.0
1
Altera Device Package Information Data Sheet
Cyclone III Devices
Thermal resistance values for Cyclone III devices are provided for a board meeting JEDEC specifications and for a typical board. The JEDEC board specifications require two signals and two power/ground planes and are available at www.jedec.org. The values are described in Tables 1 through 4.
Table 1. Thermal Resistance Values for Cyclone III Devices Value
JA (C/W) Still Air JA (C/W) 100 ft./minute JA (C/W) 200 ft./minute JA (C/W) 400 ft./minute JC (C/W) JB (C/W)
Description
Junction-to-ambient thermal resistance (JA) with no airflow when a heat sink is not being used. Junction-to-ambient thermal resistance with 100 ft./minute airflow when a heat sink is not being used. Junction-to-ambient thermal resistance with 200 ft./minute airflow when a heat sink is not being used. Junction-to-ambient thermal resistance with 400 ft./minute airflow when a heat sink is not being used. Junction-to-case thermal resistance (JC) for device. Junction-to-board thermal resistance (JB) for specific board being used.
Table 2 provides JA (junction-to-ambient thermal resistance) values and JC (junction-to-case thermal resistance) values for Cyclone III devices on a board meeting JEDEC specifications for thermal resistance calculation.
Table 2. Thermal Resistance of Cyclone III Devices for Board Meeting JEDEC Specifications (Part 1 of 2) Device
EP3C5
Package
E144 F256 U256 M164
JA (C/W) Still Air
20 32.4 32.5 38.2 20 32.4 32.5 38.2
JA (C/W) 100 ft./min.
17.5 28.9 29.1 31.5 17.5 28.9 29.1 31.5
JA (C/W) 200 ft./min.
15.4 27 27.2 29.6 15.4 27 27.2 29.6
JA (C/W) 400 ft./min.
14 25.5 25.6 27.9 14 25.5 25.6 27.9
JC (C/W)
8.4 11.7 12.2 11.6 8.4 11.7 12.2 11.6
EP3C10
E144 F256 U256 M164
2
DS-CYTHRML-3.0
Altera Corporation
Altera Device Package Information Data Sheet
Table 2. Thermal Resistance of Cyclone III Devices for Board Meeting JEDEC Specifications (Part 2 of 2) Device
EP3C16
Package
E144 Q240 F256 U256 U484 F484 M164
JA (C/W) Still Air
20 27.2 28.5 28.8 26.9 22.9 34.7 20 27 27.5 27.9 26.6 25.8 23.2 22.8 19.8 18.7 21.6 18.9 17.8 20.4 18 16.9 17.1 16
JA (C/W) 100 ft./min.
17.5 24.7 25.1 25.4 23.5 19.4 28 17.5 24.5 24.1 24.5 23.1 23.2 19.7 19.3 16.3 15.2 18.2 15.4 14.4 16.9 14.5 13.5 13.7 12.6
JA (C/W) 200 ft./min.
15.4 22.1 23.2 23.5 21.6 17.7 26.1 15.4 21.8 22.2 22.6 21.3 20.6 18 17.6 14.6 13.5 16.4 13.8 12.7 15.2 12.9 11.8 12 11
JA (C/W) 400 ft./min.
14 17.8 21.7 22 20.1 16.2 24.4 14 17.6 20.7 21.1 19.8 17 16.5 16.1 13.2 12.2 15 12.2 11.4 13.8 11.5 10.5 10.7 9.7
JC (C/W)
8 4.3 9.1 9.7 8.5 6.9 9.2 7.8 4.2 8.5 9.1 8 4 5.9 5.9 4.8 4.5 5.1 4.2 3.9 4.4 3.6 3.3 3.1 2.8
EP3C25
E144 Q240 F256 U256 F324
EP3C40
Q240 F324 U484 F484 F780
EP3C55
F484 U484 F780
EP3C80
U484 F484 F780
EP3C120
F484 F780
Table 3 provides board dimension information for each package.
Table 3. PCB Dimensions Notes (1), (2) 2.5 mm Thick Signal Layers
F780 F484 Altera Corporation 9 7 DS-CYTHRML-3.0
(Part 1 of 2) Package Dimensions (mm)
29 23
Power/Ground Layers
9 7
Board Dimensions (mm)
89 83 3
Altera Device Package Information Data Sheet
Table 3. PCB Dimensions Notes (1), (2) 2.5 mm Thick Signal Layers
U484 F324 F256 U256 Notes to Table 3:
(1) (2) Power layer Cu thickness 35 um, Cu 90% Signal layer Cu thickness 17 um, Cu 15%
(Part 2 of 2) Package Dimensions (mm)
19 19 17 14
Power/Ground Layers
7 6 6 6
Board Dimensions (mm)
79 79 77 74
7 6 6 6
Table 4 provides JA values and JB (junction-to-board thermal resistance) values for Cyclone III devices on a typical board.
Table 4. Thermal Resistance of Cyclone III Devices for Typical Board (Part 1 of 2) Device
EP3C5
Package
F256 U256
JA (C/W) Still Air
32.2 32.7 32.2 32.7 28.4 29 26.3 22.5 27.5 28.1 26.4 23.1 22.3 19.4 17.6 21.2 18.6 16.8
JA (C/W) 100 ft./min.
27.9 28.2 27.9 28.2 24.2 24.6 22.1 18.5 23.2 23.7 22.3 19 18.2 15.4 13.9 17.1 14.6 13.1
JA (C/W) 200 ft./min.
25.5 25.7 25.5 25.7 21.8 22.2 19.9 16.4 20.9 21.3 20.1 16.9 16 13.5 12.1 15 12.6 11.3
JA (C/W) 400 ft./min.
23.6 23.7 23.6 23.7 20 20.2 18.1 14.8 19.1 19.4 18.3 15.1 14.3 11.9 10.7 13.3 11.1 9.9
JB (C/W)
17.3 16.3 17.3 16.3 13.5 12.7 12.4 9.8 12.6 11.8 12.4 9.2 8.5 6.8 6.7 7.5 6 5.9
EP3C10
F256 U256
EP3C16
F256 U256 U484 F484
EP3C25
F256 U256 F324
EP3C40
F324 F484 U484 F780
EP3C55
U484 F484 F780
4
DS-CYTHRML-3.0
Altera Corporation
Altera Device Package Information Data Sheet
Table 4. Thermal Resistance of Cyclone III Devices for Typical Board (Part 2 of 2) Device
EP3C80
Package
U484 F484 F780
JA (C/W) Still Air
20 17.7 15.9 16.8 15.1
JA (C/W) 100 ft./min.
15.9 13.7 12.2 12.9 11.4
JA (C/W) 200 ft./min.
13.8 11.8 10.5 11 9.6
JA (C/W) 400 ft./min.
12.1 10.3 9.1 9.4 8.3
JB (C/W)
6.3 5.2 5.1 4.4 4.2
EP3C120
F484 F780
Cyclone II Devices
Table 5 provides JA (junction-to-ambient thermal resistance) and JC (junction-to-case thermal resistance) values for Cyclone II devices.
Table 5. Thermal Resistance of Cyclone II Devices Device
EP2C5
Package
F256 T144 Q208
JA (C/W)
0 ft./min.
30.2 31 30.4 27.0 29.8 30.2 26.6 24.2 21.0 27.6 19.4 20.6 18.6 18.4 19.6 17.7 16.9 16.3
JA (C/W)
100 ft./min.
26.1 29.3 29.2 23.0 28.3 28.2 24.0 20.0 17.0 26.4 15.4 16.6 14.6 14.4 15.6 13.7 13.0 11.9
JA (C/W)
200 ft./min.
23.6 27.9 27.3 20.5 26.9 26.9 21.4 17.8 14.8 25.4 13.3 14.5 12.6 12.4 13.6 11.8 11.1 10.5
JA (C/W)
400 ft./min.
21.7 25.5 22.3 18.5 24.9 21.7 17.4 16.0 13.1 23.8 11.7 12.8 11.1 10.9 11.9 10.2 9.7 9.1
JC (C/W)
8.7 10 5.5 7.1 9.9 5.4 4.2 5.5 4.2 9.6 3.3 5.0 3.1 2.8 4.4 2.6 2.2 2.1
EP2C8
F256 T144 Q208
EP2C20
Q240 F256 F484 T144
EP2C35
F484 U484 F672
EP2C50
F484 U484 F672
EP2C70
F672 F896
Altera Corporation
DS-CYTHRML-3.0
5
Altera Device Package Information Data Sheet
Table 6 provides JA and JB (junction-to-board thermal resistance) values for Cyclone II devices on a typical board.
Table 6. Thermal Resistance of Cyclone II Devices
Device
EP2C5 EP2C8 EP2C20
Package
F256 F256 F256 F484
JA ( C/W) Still Air
30.2 27.9 24.7 20.5 18.8 20.0 17.7 19.0 17.4 16.5 15.7 14.6
JA ( C/W) 100 ft./min.
25.8 23.2 20.1 16.2 14.5 15.5 13.5 14.6 13.3 12.4 11.7 10.7
JA ( C/W) 200 ft./min.
22.9 20.5 17.5 13.9 12.3 13.2 11.4 12.3 11.3 10.5 9.8 8.9
JA ( C/W) 400 ft./min.
20.6 18.4 15.3 12.2 10.6 11.3 9.8 10.6 9.8 9.0 8.3 7.6
JB (C/W)
14.8 12.3 9.1 7.2 5.7 5.3 4.5 4.4 5.5 4.6 3.8 3.7
EP2C35
F484 U484
EP2C50
F484 U484
EP2C35 EP2C50
F672 F672 F672
EP2C70
F896
Cyclone Devices
Table 7 provides JA (junction-to-ambient thermal resistance) and JC (junction-to-case thermal resistance) values for Cyclone devices.
Table 7. Thermal Resistance of Cyclone Devices (Part 1 of 2) Device
EP1C3
Pin Count
100 144
Package
TQFP TQFP TQFP PQFP FBGA PQFP FBGA FBGA
JC (C/W)
11.0 10.0 9.8 4.3 8.8 4.0 6.6 6.1
JA (C/W) JA (C/W) JA (C/W) JA (C/W) Still Air 100 ft./min. 200 ft./min. 400 ft./min.
37.5 31.1 29.4 27.2 28.7 26.0 24.3 23.0 35.4 29.4 28.0 24.7 24.5 23.4 20.2 19.8 33.4 27.9 26.7 22.1 22.3 20.8 18.1 17.7 29.8 25.5 24.7 17.8 20.5 17.1 16.4 16.1
EP1C6
144 240 256
EP1C12
240 256 324
6
DS-CYTHRML-3.0
Altera Corporation
Altera Device Package Information Data Sheet
Table 7. Thermal Resistance of Cyclone Devices (Part 2 of 2) Device
EP1C20
Pin Count
324 400
Package
FBGA FBGA
JC (C/W)
5.0 4.7
JA (C/W) JA (C/W) JA (C/W) JA (C/W) Still Air 100 ft./min. 200 ft./min. 400 ft./min.
21.0 20.7 17.7 17.5 15.6 15.5 14.1 13.9
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Altera Corporation
DS-CYTHRML-3.0
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